Date: 2002/06/21, 16:27:04
Name: ICT( )
IP: 61.82.73.213
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PCB head construction methods gave an impetus to the common use
PCB industries have been open up head construction methods such as Neo Manhattan Bump Interconnection, Stack Via and Filp Chip, given an impetus to make common use of it.
Major PCB makers like LG Electronics or Samsung Electro-Mechanics recently completed and are doing sample test for PCB head construction methods which make infinitesimal and high immediateness electronic circuit. LG Electronics DMC Business Dept. completed to develope NMBI technology which is an advanced package method and is doing sample test. This method is using bump and process microvia(below dim. 150mycron). If it becomes common used it can reduce half of existing multi-layer PCB. As a result, LG expects that the cost of production can be decreased remarkably.
Samsung Electro-Mechanics is focusing on making common use of Flip Chip method within this year. They plan to invest on the equipment for semiconductor panels production using Flip chip method and dash into the production at least in the beginning of next year. This technology works with bump on chips, then connect the bump with the panel to interlink chip and panel circuit. This eventually improves speed and noise problem, therefore used with high performance work station products. This company also takes positive action upon Stack Via method. Samsung is in the middle of sample production and expects the appicaion of actual work site operation within early future. This suits advanced mobile machine because it forms microvia in the interior and exterior layers and links electronic circuits between layers.
Daeduck Electronics concentrates on common use of head methods like Stack Via. Moreover, they are putting efforts to the development of photoelectricity method which puts opto-foil into inter layer of panel, then fits for high speed server.
All this presents that to raise quality and to reduce cost through common use of head methods are strong needs to survive in global competition. A person concerned remarked "these methods only in the state for sample production even in advanced countries." and "prior occupation on future technology has high priority for communication machinery, semiconductor and mobile connection tools to survive in rapid development and the world market."
[The Electronic Times] smahn@etnews.co.kr
Date : 2002/05/30
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PCB head construction methods gave an impetus to the common use [The Electronic Times 2002. 5.30]
Korean Economy growth prospect in year 2003
PCB head construction methods gave an impetus to the common use [The Electronic Times 2002. 5.30]
